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Electronics Inspection Electronics inspection covers a wide range of applications in the printed circuit board and semiconductor assembly industries. Multilayer boards are tested for shorts and opens, or to ensure that linewidths and other design rules are kept within limits. Die attach and other adhesives are tested for voids that can cause failure later on. Solder joints on ball grid arrays, gull wing and other packages need to be inspected for proper wetting. And inside the package, wire bonds can be imaged at high magnification for failure analysis as well as process control studies.
Please click on an image below to see a full size version:
 Gold wirebonds at ~100:1 magnification (image courtesy of Oxford Instruments). |
Ball grid array with wirebonds |
IC leadframe with wirebonds |
 Circuit board with die attach adhesive. |
 Inside a cellphone (image courtesy of Oxford Instruments). |
 3D view of 4-layer PCB. |
© 2001-2008 Rad-icon Imaging Corp.
